Job Description

If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time .

At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates.

Requisition ID: 75566 

Job Description

We are seeking a highly skilled Engineering Technician to assist our engineering team in the development of RF Front End Modules. You will be working closely with talented minds transforming technology with new ideas. Our fast-paced environment enables you to collaborate with experts at all levels within the company and make real-world contributions by working on critical projects for delivery to customers with significant impacts. We invite you to come to be a part of the wireless networking revolution as you turn on and power-up your career. 

The ideal candidate should have extensive hands-on experience with phone board rework, assembly, soldering fine pitch passive components, manual flip chip assembly, precision rework on sensitive devices and support RF testing. This role involves working under a microscope for detailed inspection and rework activities on multi-layer complex PCBs. 

Responsibilities

• Support New Product development and assembly of engineering prototype builds.
• Work closely with the Engineering Team on Multi-Chip Module (MCM) assembly and development.
• Perform programming, setup and operation of stencil screen printer, reflow oven, surface mount (FUJI NXTIII), auto die attach (Datacon), Molding (TOWA), marking and dicing saw (Disco) 
• Create auto wire bond programs and loop profiles in K&S Maxum bonder. Support wire bond process characterization and optimization to achieve desired performance specification. Record and document for repeatability and production readiness.
• Responsible for assembly lab equipment setup, parameter settings, process verification, and maintenance
• Perform manual die pick and placement using tweezers or pickup tools, epoxy / DAF attach on MCMs. The tasks are a combination of manual assembly and equipment operation, involve working with the aid of a microscope and tools for handling very small parts for prototyping.
• Support customized build request, mount MCMs on evaluation boards by solder attach. Perform manual soldering, attach passive components, perform rework on boards, change components, mount dies, and wire bond.
• Candidate must be able to work from schematics, diagrams, written and verbal descriptions, layouts or defined plans to perform assembly functions. Candidate must know how to interpret builds and BOM (Bill of Material). Must be proficient using hand tools such as tweezers, picks, vacuum pencils. Understanding die bonding, wire bonding, flip chip assembly and test fixtures is also desired.
• Candidate should be self-motivated team player with a strong desire to succeed. Must have team-oriented attitude, accountability and ownership.

Required Experience and Skills

• Associate degree or equivalent years of experience 3+ years.
• Strong experience in IC assembly process technology, operation and maintenance of assembly tools. 
• Work from Schematic drawings for assembly builds and follow specifications for qualification of new designs.
• Experience with hand tools (e.g., Tweezers, Vacuum pickup tools, Soldering Irons, die handling, test fixtures)
• Experience with computers using Microsoft excel, word, power point and Microsoft outlook.

Desired Experience and Skills

• Stencil screen print, SMT, reflow, manual die attach, wire bonding, molding, marking, dicing saw, soldering and printed circuit assembly experience, working from engineering drawings, and markups. Trained to handle ESD sensitive electronic components, and experience working with the aid of a microscope.

The typical base pay range for this role across the U.S. is currently USD $32.69 - $57.16 per hour . Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance. 

Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law. Skyworks strives to create an accessible workplace; if you need an accommodation due to a disability, please contact us at accommodations@skyworksinc.com.

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